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TC2117
800 mA Fixed Low Dropout Positive Regulator
Features
* * * * * * * Fixed Output Voltages: 1.8V, 2.5V, 3.0V, 3.3V Very Low Dropout Voltage Rated 800 mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Overcurrent and Overtemperature Protection Space Saving SOT-223 Package
General Description
The TC2117 is a fixed, high accuracy (typically 0.5%) CMOS low dropout regulator. Designed specifically for battery operated systems, the TC2117's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 80 A at full load (20 to 60 times lower than in bipolar regulators). TC2117 key features include ultra low noise, very low dropout voltage (typically 450 mV at full load), and fast response to step changes in load. The TC2117 incorporates both overtemperature and overcurrent protection. The TC2117 is stable with an output capacitor of only 1F and has a maximum output current of 800 mA. This device is available in 3-Pin SOT-223, and 3-Pin DDPAK packages.
Applications
* * * * * * 5V to 3.3V Linear Regulator Portable Computers Instrumentation Battery Operated Systems Linear Post-Regulator for SMPS Core Voltage Supply for FPGAs, PLDs, CPUs, DSPs
Package Types
3-Pin SOT-223 Front View VIN VOUT 1 2 3 GND GND VOUT VIN 3 3-Pin DDPAK Front View Tab is VOUT Tab is VOUT
Typical Application
VIN C1 1F Battery VOUT VOUT C2 1F
TC2117
TC2117
GND
TC2117
(c) 2006 Microchip Technology Inc.
1
2
DS21665C-page 1
TC2117
1.0 ELECTRICAL CHARACTERISTICS
Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage .........................................................6.5V Output Voltage.................... (VSS - 0.3) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin .........VIN +0.3V to -0.3V Operating Temperature ............... -40C < TJ < +125C Storage temperature ..........................-65C to +150C
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 A, CL = 3.3 F, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Parameters Input Operating Voltage Maximum Output Current Output Voltage Sym VIN IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Min 2.7 800 VR - 2.5% VR - 2% VOUT Temperature Coefficient Line Regulation Load Regulation (Note 4) Dropout Voltage (Note 5) -- -- -0.01 -- -- -- -- -- -- -- Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise Note 1: IDD PSRR IOUTSC VOUT/PD eN -- -- -- -- -- Typ -- -- VR 0.5% 40 0.007 0.002 20 50 150 260 450 1000 1200 80 55 1200 0.04 300 Max 6.0 -- VR + 3% -- 0.35 0 30 160 480 800 1300 1200 1400 130 -- -- -- -- A db mA V/W nV/Hz F 1 kHz VOUT = 0V Note 6 IL = 100 mA, F = 10 kHZ ppm/C % %/mA mV Units V mA V VR 2.5V VR = 1.8V Note 3 (VR + 1V) VIN 6V IL = 0.1 mA to IOUTMAX VR 2.5V, IL = 100 A VR 2.5V, IL = 100 mA VR 2.5V, IL = 300 mA VR 2.5V, IL = 500 mA VR 2.5V, IL = 800 mA VR = 1.8V, IL = 500 mA IL = 800 mA SHDN = VIH, IL = 0 Note 2 Conditions
VR 0.5% VR + 2.5%
VR is the regulator output voltage setting. The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
2:
3:
( V OUTMAX - V OUTMIN ) - 10 TCV OUT = -----------------------------------------------------------------------V OUT x T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.2 "Thermal Considerations" for more details.
6
4:
5: 6: 7:
DS21665C-page 2
(c) 2006 Microchip Technology Inc.
TC2117
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 A, CL = 3.3 F, SHDN > VIH, TA = +25C. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 3L-SOT-223 Thermal Resistance, 3L-DDPAK Note 1: JA JA -- -- 59 71 -- -- C/W C/W TA TJ TA -40 -40 -65 -- -- -- +125 +125 +150 C C C (Note 1) Sym Min Typ Max Units Conditions
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125C).
(c) 2006 Microchip Technology Inc.
DS21665C-page 3
TC2117
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020 0.018
LINE REGULATION (%)
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002
VIN = 3.5V to 6.0V VOUT = 2.5V IOUT = 0.1mA
150 135 120 105 90 75 60 45 30 15 0
VIN = VOUT +1V IOUT = 0.1mA
I DD(mA)
VOUT = 5V VOUT = 2.5V
0.000 -40C 0C
25C
70C
85C
125C
-40C 0C
25C
70C
85C
125C
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-1: Temperature.
10.0
Line Regulation vs.
FIGURE 2-4:
IDD vs. Temperature.
DROPOUT VOLTAGE (V)
1.0
CIN = 1 F C OUT = 1 F V IN = 6.0V VOUT = 5V I OUT = 100 mA
0.600 0.550 0.500 0.450 0.400 0.350 0.300 0.250 0.200 0.150 0.100 0.050 0.000
85C 70C 25C
VOUT = 3V
125C
0C -40C
0.1
0.0 0.01
0.01
1
10
100
1000
0 100 200 300 400 500 600 700 800
FREQUENCY (kHz)
I LOAD (mA)
FIGURE 2-2:
0.0100
Output Noise vs. Frequency.
FIGURE 2-5:
3.030 3.020 3.010 3.000
Dropout Voltage vs. ILOAD.
ILOAD = 0.1 mA ILOAD = 300 mA ILOAD = 500 mA
LOAD REGULATION %/mA
0.0090 0.0080 0.0070 0.0060 0.0050 0.0040 0.0030 0.0020 0.0010 0.0100 -40C 0C 25C 70C 85C 125C VOUT = 3V 1 mA to 800 mA
VOUT (V)
2.990 2.980 2.970 2.960 2.950 2.940 2.930 2.920 -40C 0C 25C
ILOAD = 800 mA
70C
85C
125C
TEMPERATURE (C)
TEMPERATURE (C)
FIGURE 2-3: Temperature.
Load Regulation vs.
FIGURE 2-6:
3.0V VOUT vs.Temperature.
DS21665C-page 4
(c) 2006 Microchip Technology Inc.
TC2117
Typical Performance Curves (Continued)
-10 -20 PSRR (dB) -30 -40 -50 -60 -70 10 100 1k
f (Hz)
IOUT=300 mA VIN=4.0V to 5.0V COUT=10 F Tantalum (0.25 ESR) CIN=NA
VOUT 50 mV/DIV
10k 100k 1M
FIGURE 2-7: Ratio.
Power Supply Rejection
FIGURE 2-9:
Line Step Response
VIN=4.0V VOUT=3.0V CIN=1 F Ceramic COUT=10 F Ta
50 mV/DIV
600 mA/DIV
FIGURE 2-8:
Load Step Response.
(c) 2006 Microchip Technology Inc.
DS21665C-page 5
TC2117
3.0 PIN DESCRIPTIONS
The descriptions for the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. (3-Pin SOT-223) (3-Pin DDPAK) 1 2 3
PIN FUNCTION TABLE
Symbol GND VOUT VIN Ground Terminal. Regulated output voltage. Unregulated Supply input. Description
3.1
Ground (GND)
3.3
Unregulated Supply (VIN)
Ground terminal.
Unregulated supply input
3.2
Regulated Output Voltage (VOUT)
Regulated voltage output.
DS21665C-page 6
(c) 2006 Microchip Technology Inc.
TC2117
4.0 DETAILED DESCRIPTION
4.2.2 POWER DISSIPATION
The TC2117 is a precision, positive output LDO. Unlike bipolar regulators, the TC2117 supply current does not increase proportionally with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to 800 mA operating load range. The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation:
EQUATION 4-1:
P D = ( V INMAX - V OUTMIN )I LOADMAX Where: PD = Worst-case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (+125C) and the thermal resistance from junction-to-air (JA).
FIGURE 4-1:
TYPICAL APPLICATION CIRCUIT
VIN C1 1F VOUT VOUT C2 1F
TC2117
GND
Battery
4.1
Output Capacitor
A 1 F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance of 0.2 to 10. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
EQUATION 4-2:
PDMAX = (TJMAX - TAMAX)
JA
Where all terms are previously defined. Table 4-1 shows various values of JA for the TC2117 mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper foil.
TABLE 4-1:
THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN SOT-223 PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 0 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm 2500 sq mm 1000 sq mm 1000 sq mm Thermal Resistance 45C/W 45C/W 53C/W 59C/W 52C/W 55C/W
4.2
4.2.1
Thermal Considerations
THERMAL SHUTDOWN
Copper Area (Topside)* 2500 sq mm 1000 sq mm 225 sq mm 100 sq mm 1000 sq mm 1000 sq mm
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
* Tab of device attached to topside copper.
(c) 2006 Microchip Technology Inc.
DS21665C-page 7
TC2117
TABLE 4-2: THERMAL RESISTANCE GUIDELINES FOR TC2117 IN 3-PIN DDPAK PACKAGE
Copper Area (Backside) 2500 sq mm 2500 sq mm 2500 sq mm Board Area 2500 sq mm 2500 sq mm 2500 sq mm Thermal Resistance (JA) 25C/W 27C/W 35C/W
Copper Area (Topside)* 2500 sq mm 1000 sq mm 125 sq mm
*Tab of device attached to topside copper.
Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 5.0V 5% VOUTMIN = 3.3V 0.5% ILOADMAX = 400 mA TJMAX = 125C TAMAX = 55C JA = 59C/W (SOT-223) Find: 1. Actual power dissipation 2. Maximum allowable dissipation
Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(5.0 x 1.05) - (3.3 x .995)] 400 x 10-3 = 786 mW Maximum allowable power dissipation: PDMAX = = = (TJMAX - TAMAX) JA (125 - 55) 59 1.186W
In this example, the TC2117 dissipates a maximum of only 786 mW; below the allowable limit of 1.186W. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits.
DS21665C-page 8
(c) 2006 Microchip Technology Inc.
TC2117
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
3-Lead DDPAK Example
XXXXXXXXX XXXXXXXXX YYWWNNN
TC2117 e3 1.8VEB^^ 0643256
3-Lead SOT-223
Example
XXXXXXX XXXYYWW NNN
2117-25 VDB0643 256
Legend: XX...X Y YY WW NNN
e3
* Note:
Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
(c) 2006 Microchip Technology Inc.
DS21665C-page 9
TC2117
3-Lead Plastic (EB) (DDPAK)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
E
L3
E1
D2 D D1
1 b e TOP VIEW b1 BOTTOM VIEW (5X) c2 A1 c Units Dimension Limits Number of Pins Pitch Overall Height Standoff Overall Width Exposed Pad Width Molded Package Length Overall Length Exposed Pad Length Lead Thickness Pad Thickness Lower Lead Width Upper Lead Width Foot Length Pad Length Foot Angle Mold Draft Angle e A A1 E E1 D D1 D2 c c2 b b1 L L3 .330 .549 .014 .045 .026 .049 .068 .045 -3 .170 .000 .385 1.00 BSC .177 .005 .398 .256 REF .350 .577 .303 REF .020 -.032 .050 ----.026 .055 .037 .051 .110 .067 8 7 0.36 1.14 0.66 1.24 1.73 1.14 -3 .370 .605 8.38 13.94 .183 .010 .410 4.32 0.00 9.78 MIN L INCHES* NOM 3 2.54 BSC 4.50 0.13 10.11 6.50 REF 8.89 14.66 7.70 REF 0.51 -0.81 1.27 ----0.66 1.40 0.94 1.30 2.79 1.70 8 7 9.40 15.37 4.65 0.25 10.41 MAX MIN MILLIMETERS NOM 3 MAX
A
* Controlling Parameter Significant Characteristic Notes: Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. BSC: Basic Dimension. Theoretically, exact value shown without tolerances. See ASME Y14.5M REF: Reference Dimension, usually without tolerance, for information purposes only. See ASME Y14.5M Revised 07-19-05 JEDEC equivalent: TO-252 Drawing No. C04-011
DS21665C-page 10
(c) 2006 Microchip Technology Inc.
TC2117
3-Lead Plastic Small Outline Transistor (DB) (SOT-223)
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
D b2
E1
E
1
e e1 A2 A c
b Units Dimension Limits MIN e e1 A A1 A2 E E1 D c b b2 L - .001 .061 .264 .130 .248 .009 .026 .114 .035 0 10 10 A1 INCHES NOM .091 BSC .181 BSC - - .063 .276 .138 .256 .012 .030 .118 - - - - .071 .004 .065 .287 .146 .264 .014 .033 .124 - 10 16 16 - 0.02 1.55 6.70 3.30 6.30 0.23 0.65 2.90 0.90 - 10 10 MAX MIN L MILLIMETERS* NOM 2.30 BSC 4.60 BSC - - 1.60 7.00 3.50 6.50 0.30 0.76 3.00 - 0.37 - -
MAX
Pitch Outside lead pitch (basic) Overall Height Standoff Molded Package Height Overall Width Molded Package Width Overall Length Lead Thickness Lead Width Tab Lead Width Foot Length Lead Angle Mold Draft Angle, Top Mold Draft Angle, Bottom
1.80 0.10 1.65 7.30 3.70 6.70 0.35 0.85 3.15 - 10 16 16
* Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side. BSC: Basic Dimension. Theoretically exact value shown without tolerances. See ASME Y14.5M JEDEC Equivalent TO-261 AA Revised 09-13-05 Drawing No. C04-032
(c) 2006 Microchip Technology Inc.
DS21665C-page 11
TC2117
NOTES:
DS21665C-page 12
(c) 2006 Microchip Technology Inc.
TC2117
APPENDIX A: REVISION HISTORY
Revision C (October 2006)
* Section 1.0 "Electrical Characteristics": Changed dropout voltage voltage typical value for IL = 500 mA from 700 to 1000 and maximum value from 1000 to 1200 for. Changed typical value for IL = 800 mA from 890 to 1200 * Section 5.0 "Packaging information": Added package marking information and package outline drawings * Added disclaimer to package outline drawings. * Added Appendix A Revision History
Revision B (May 2002)
* Not Documented
Revision A (May 2001)
* Original Release of this Document.
(c) 2006 Microchip Technology Inc.
DS21665C-page 13
TC2117
NOTES:
DS21665C-page 14
(c) 2006 Microchip Technology Inc.
TC2117
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X.XX Voltage Option XX Package XX Tape and Reel Examples:
a) b) c) Device Voltage Option:* TC2117 Fixed Output CMOS LDO Positive Regulator 1.8V 2.5V 3.0V 3.3V = = = = 1.8V 2.5V 3.0V 3.3V d) a) b) c) d) e) f) g) h) TC2117-1.8VEBTR 1.8V LDO, DDPAK-3 pkg., Tape and Reel TC2117-2.5VEBTR 2.5V LDO, DDPAK-3 pkg., Tape and Reel TC2117-3.0VEBTR 3.0V LDO, DDPAK-3 pkg., Tape and Reel TC2117-3.3VEBTR 3.3V LDO, DDPAK-3 pkg., Tape and Reel TC2117-1.8VDB 1.8V LDO, SOT-223 pkg. TC2117-1.8VDBTR 1.8V LDO, SOT-223 pkg., Tape and Reel TC2117-2.5VDB 2.5V LDO, SOT-223 pkg. TC2117-2.5VDBTR 2.5V LDO, SOT-223 pkg., Tape and Reel TC2117-3.0VDB 3.0V LDO, SOT-223 pkg. TC2117-3.0VDBTR 3.0V LDO, SOT-223 pkg., Tape and Reel TC2117-3.3VDB 3.3V LDO, SOT-223 pkg. TC2117-3.3VDBTR 3.3V LDO, SOT-223 pkg., Tape and Reel
* Other output voltages are available. Please contact your local Microchip sales office for details. Package DB = DBTR = EB = EBTR = Plastic (SOT-223), 3-lead Plastic (SOT-223), 3-lead, Tape and Reel Plastic Transistor Outline (DDPAK), 3-Lead Plastic Transistor Outline (DDPAK), 3-Lead, Tape and Reel
(c) 2006 Microchip Technology Inc.
DS21665C-page 15
TC2117
NOTES:
DS21665C-page 16
(c) 2006 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
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(c) 2006 Microchip Technology Inc.
DS21665C-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
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Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
10/19/06
DS21665C-page 18
(c) 2006 Microchip Technology Inc.

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